- 介紹
Features
? Higher DC bias current and lower DCR
? Low profile and thin thickness
? Monolithic structure for high reliability
? Excellent solderability and high heat resistance
? No cross coupling due to magnetic shield
Application
? Notebooks and Tablets Devices
? Smartphones, Wearable devices
? Communication Devices
請選擇你需要的尺寸
Please choose the size which you need
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